ug585-Zynq-7000-TRM. (on time) 4h 11m total travel time. So you need to choose a combination that makes PCIe hardblock closer to GT quad. BOOT AND CONFIGURATION. import existing book. Loading Application. Also, when I try to create a bus with less than 2 bytes worth of bits, I see many LVDS pair hidden from the drop down. The co-ordinates information found in the device view are correct and a documentation CR is filed to fix (UG575). 12) August 28, 2019 08/18/2014 1. Using the buttons below, you can accept cookies, refuse cookies, or change. This web page provides the pinout files for the UltraScale and UltraScale+ packages, which are used in Xilinx FPGA devices. Hi, I am looking for the thermal resistance from junction to board and thermal resistance from junction to case for the XQVU5P-1FLQA2104I. DMA 使用之 ADC 示波器 (AN9238) 25. POWER & POWER TOOLS. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information. MSL is a number between 1 and 7. GilSpecifications (UG575). I have read in ug575 some recommendations about heatsink attachment for lidless package. I have attached a link to UG575, which will give you an idea on how to design the thermal management system for your part. Does Xilinx provide OrCAD symbol files ? If not, how to use the ASCII Pinout Files. 1) besides, there are some warning messages showed below: WARNING: [Xicom 50-38. I want to use 5 DDR4 component memories (x16 type) and i need to connect them to 3 HP banks (44,45,46) because of resource availability. and is protected under U. com. tyhero (Member) 5 years ago **BEST SOLUTION** Yes, the ports are not right. デバイス資料 (ザイリンクス) 『Zynq-7000 SoC テクニカル リファレンス マニュアル』 (UG585) は、Zynq SoC のアーキテクチャ、機能、および制御およびステータス レジスタの詳細な説明を含む総合的なユーザー ガイド (1700ページ以上) です。. If you typed it in correctly and it's still not showing up, or you're not completely sure of the flight number, you should use the Flight. Resources Developer Site; Xilinx Wiki; Xilinx Github; Support Support CommunityHi, We will use Virtex Ultra+ FPGA (XCVU13P-2FLGA2577E) in our project. A single PCIe4 Integrated Block is capable of Gen3x16, but this requires 4 adjacent GT Quads. GTH transceivers in A784, A676, and A900 packages support data rates up to 12. Selected as Best Selected as Best Like Liked Unlike 1 like. So if you look at the package overview section in UG575 you see the conceptual diagram of each VUP device. Loading Application. hello, Regarding soldering of the XCKU060-2FFVA1517E (used in one of our projects): ug1099 (v1. The similar Bank is the XCKU3P-SFVB784/FFVD900, too. Resources Developer Site; Xilinx Wiki; Xilinx Github 注 : zip ファイルには、txt および csv 形式の ascii パッケージ ファイルが含まれます。このファイル形式は、ug575 で説明されています。 Note: The zip file includes ASCII package files in TXT format and in CSV format. Is the 6mil shown here a mistake? Thank you. All Answers. Standard 2075, Edition 2 Edition Date: March 05, 2013 ANSI Approved: August 04, 2023 USD. + Log in to add your community review. UltraScale Architecture Configuration 3 UG570 (v1. The web page is a forum thread from Xilinx users who discuss the topic of UG575 v1. Expand Post. 6 で、正しい座標情報が含まれるようになる予定です。Hi, We will use Virtex Ultra+ FPGA (XCVU13P-2FLGA2577E) in our project. UG475 is a user guide that provides detailed information on the pinout and package specifications of the 7 series FPGAs from Xilinx. It seems the value for M is too high (UG575, table 8-1). 8. // Documentation Portal . I've read the thermal section in UG575, but I don't have the capability or know-how to perform thermal modeling. The GTY tranceiver is a hard block inside the FPGA, and there are. Footprint compatibility means that nothing catastrophic will happen (eg. Hi, We see that UG575 mentions the BGA nominal dia of 0. 12. All Answers. (XAPP1283) Internal Programming of BBRAM and eFUSEs. ) Go ASCII Pinout Files chapter in this Device Packaging and Pinouts guide. Dynamic IOD Interface Training. 问题：Transceivers使用2个Quad，在实现的过程中，布局出现错误如截图，按照resolution解决，可以实现布线，但是不能生成bitfile，出现部分的nets不能route<p></p><p></p>问题截图、代码. For Zynq UltraScale (as shown by ashishd), see UG1075. High DSP and block RAM-to-logic ratios, and next generation transceivers are combined with low-cost packaging to enable an optimum blend of capability for these applications. Clocking Overview. 注 : zip ファイルには、txt および csv 形式の ascii パッケージ ファイルが含まれます。このファイル形式は、 ug575 で説明されています。Edited by wcassell June 12, 2022 at 11:03 PM. // Documentation Portal . 3. // Documentation Portal . . In order to use Tandem PCIe, PCIe Block Locations are X1Y2 for VU9P (as per Figure 1-100 in UG575 v1. UG575, UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification UG576, UltraScale Architecture GTH Transceivers User Guide UG578, UltraScale Architecture GTY Transceivers User Guide UG579, UltraScale Architecture DSP Slice User Guide UG580, UltraScale Architecture System Monitor User Guide2. ryana (AMD) Edited by User1632152476299482873 September 25, 2021 at 3:24 PM. C3 C34 1962 The invisible war: the untold secret story of Number One Canadian Special Wireless Group, Royal Canadian Signal Corps, 1944-1946 / by Gil Murray. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information. UG575 (v1. Selected as Best Selected as Best Like Liked Unlike 3 likes. // Documentation Portal . For example, Bank 68, 13-bit wide bus excludes the option to use A14/B14. // Documentation Portal . 7. Are there any rules of thumb for power draw threshold from the ultrascale parts that requires a heat sink? I suspect my design will be fine without one. Loading. The table shows that the KU11P has 4 PCIe4 Integrated Blocks. Spartan™ 6 FPGA Package Files. R evision His t ory. We need to use OrCAD symbols in (. Product Specification (UG575) . This question is for testing whether or not you are a human visitor and to prevent automated spam submissions. A third way to answer the question is to create a Vivado project for your device and open the “Package Pins” window shown below. Loading Application. . In the ZYNQ instance inside IPI, the IRQ_F2P bus cannot be changed from [0:0] even though the documentation states it's a 16 bit bus. In the Xilinx UltraScale and UltraScale+ Architectures, it is recommended to use SAME_CMT_COLUMN instead of BACKBONE. I'm stuck in the Aurora IP customization. 3. Thermal. Xilinx does not provide OrCAD schematic symbols. Product Application Engineer Xilinx Technical Support要找一下 kintex-ultrascale系列器件的BANK 0 pin脚配置说明；请告知具体在哪一份文档？. Please check with ug575 and ug583. It includes diagrams, tables, and. Hi , Could you please provide the detailed thermal model of the VU13P Package in . Is it an older revision I have now or? Can you send me a link? ThanksDSP IP & TOOLS. You don't even need to open Vivado to get this information, it is available in text format in the User Guides. 3 of UG575 will be available and if it will be compatible with the new KU085 and KU095 devices. You also see the available banks in ug575, page63, figure 1-16. 1 Removed “Advance Spec ification” from document ti tle. Hi, Sir: I implemented a IBERT ip in the design, but the link was got wrong location (X0Y73) with no-link in Quad126. J. AMD offers a comprehensive multi-node portfolio to address requirements across a wide set of applications. 0. // Documentation Portal . Reader • AMD Adaptive Computing Documentation Portal. Value. 46 [get_ports SYSCLK_P]Hi team, Would like to confirm if package type of MPN: XC6VLX240T-2FFG1156C belongs to FFVA1156? Thanks. hello, Regarding soldering of the XCKU060-2FFVA1517E (used in one of our projects): ug1099 (v1. Then I create an xdc file and add constraints like these: create_clock -add -name sys_clk_pin -period 13. UltraScale Architecture GTY Transceivers 4 UG578 (v1. CSV) files available in OrCAD? ブート. Loading Application. Multiple integrated PCI Express ® Gen3 cores. Viewer • AMD Adaptive Computing Documentation Portal. 8mm ball pitch. 11). You can contact Amanang Child Development Center UG839 by phone using number 0772 958281. . 85V or 0. KeithThese pinout files can be downloaded using links found in Chapter 2 of UG575. For UltraScale and UltraScale+, see UG575. Date V ersion Revision. 1) is incorrect. // Documentation Portal . We would like to show you a description here but the site won’t allow us. 2. Facts At A Glance. Hello, I am currently designing a heatsink solution (heatsink + thermal pad) for a FPGA Ultrascale with a lidless package (XCKU035 FBVA900). MSL レベル 1 のパッケージは感湿度が最も低く、数値が大きいほど感湿度が高くなります。. The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices. Both of these blocks have fixed locations for the particular device package combination. However, I am not able to access them. 97 km 8MQR+45P. For pin naming conventions, refer to the UltraScale Architecture Packaging and Pinout User Guide (UG575) [Ref 2]. AMD Virtex UltraScale+ XCVU13P. Table 1-5 in UG575(v1. DMA 使用之 DAC 波形发生器(AN108) 23. cara mendapatkan freechip di situs agen slot UG36 dengan menggunakan bocoran kode rahasia langsung dari pengembang situs agen slot UG36See UG575, UltraScale Architectu re Packaging and Pinou ts User Guide f or more information. Loading Application. Hello. (rouhgly 13*51 - 1/2 * 51 HP and 2 * 24 HR). This pin is actually connected to the SMBALERT of SYSMONE4_ TS pin. You don't even need to open Vivado to get this information, it is available in text format in the User Guides. UltraScale Architecture GTY Transceivers 4 UG578 (v1. For a quick estimate you can look at bank numbers, usually they are consecutive for the same column with a gap between columns but there is no number gap for the SLR split. Loading Application. No - although some would refer you to the GSR (Global Set/Reset) pin of the STARTUPE3 primitive - see page 118 of UG570(v1. We would like to show you a description here but the site won’t allow us. refer the attached images for Xilinx & Si5391(PLL planned to use) LVPECL termination requirements. Thank you!. 1) August 16, 2018 09/15/2015 1. Solution. . 12) helps us. Thermal analysis software : 6SigmaET . In this case you can see we only support HP banks. L4630 4630 For more information would like to show you a description here but the site won’t allow us. 4 Added configuration information for the KU025 device. Canadian Army. Product Application Engineer Xilinx Technical SupportLoading Application. AMD Adaptive Computing Documentation Portal. デバイス資料 (ザイリンクス) 『Zynq-7000 SoC テクニカル リファレンス マニュアル』 (UG585) は、Zynq SoC のアーキテクチャ、機能、および制御およびステータス レジスタの詳細な説明を含む総合的なユーザー ガイド (1700ページ以上) です。. junction, case, ambient, etc. ddn (AMD) Edited by User1632152476299482873 September 25, 2021 at 3:29 PM **BEST SOLUTION**. Expand Post. . PROGRAMMABLE LOGIC, I/O AND PACKAGING. Resources Developer Site; Xilinx Wiki; Xilinx GithubFCS2_B is a general-purpose IO pin of the FPGA (see Table 1-5 in UG575(v1. Please provide the clarification related to this issue. Can you please suggest what is the recommended PCB pad size for them? Also, We are using via-in-pad structure. I have scrapped some I/O pinout configurations from here but I. Reader • AMD Adaptive Computing Documentation Portal. 3 IP name: IBERT Ultrascale GTH version: 1. 0) and UG575 (v1. Saturday 13-May-2023 08:02AM PDT. UltraScale Architecture GTY Transceivers 4 UG578 (v1. Expand Post. Are there any rules of thumb for power draw threshold from the ultrascale parts that requires a heat sink? I suspect my design will be fine without one. Ex. 您可以看一下你的IP core是否配置正确，引脚分配是不是放置在合理的位置上。可以看一下 IBUFDS_GT 的一些限制要求等等。please， i can not find IBUFGDS for ultrascale in language templates in vivado 2018. • The following filter capacitor is recommended: ° 1 of 4. Definition of a No-Connect pin. // Documentation Portal . 3 (Cont’d)デバイス ビューの座標情報が正しいため、ug575 を修正するよう変更リクエストが提出されています。 2016 年 1 月以前にリリース予定の ug575 v1. Resources Developer Site; Xilinx Wiki; Xilinx GithubUltraScale Architecture GTH Transceivers 6 UG576 (v1. 18) April 22, 2022 Chapter 4: Mechanical Drawings UBVA368 Flip-Chip, Fine-Pitch BGA (XCAU10P and XCAU15P) X-Ref Target - Figure 4-1 Figure 4-1: Package Dimensions for UBVA368 (XCAU10P and XCAU15P) ug575_ch5_030122 Send Feedback MSL is a number between 1 and 7. 8mm ball pitch. I am trying to make a hardware design with ultrascale xcku035-ffva1156 FPGA. // Documentation Portal . Log In to Answer. 4 (Rev. For full part number details, see the Ordering Information section in DS890, UltraScale Architecture and Product Overview. (XAPP1188) FPGA Configuration from SPI Flash Memory using a Microprocessor. Zi Fox (Member) 2 months ago >>Are any other PCIe boards being used in your system? An x16 GPU could be claiming different numbers of PCIe lanes. Interface calibration and training information available through the Vivado hardware manager. UG575 (v1. 1 Removed “Advance Spec ification” from document ti tle. (see figure below). UltraScale FPGA BPI Configuration and Flash Programming. Community Reviews (0) Feedback? No community reviews have been submitted for this work. Thanks for your reply. I have purchased XC9572 PC44 devices recently. To determine factory floor life and soak requirements, and for more information on moisture sensitivity, refer to Chapter 6 of (UG112) the Device Package User Guide. This site uses cookies from us and our partners to make your browsing experience more efficient, relevant, convenient and personal. However, use-case for Bank 47, 48 and 66 is not allowed since they are not in the same column. The island. I dont find in ug575. I want Delphi tables. 7 µF ±10% • For optimal performance, power supply noise must be less than 10 mVpp. How DragonBoard is Made. The general info should be located in the package implementation Xilinx application notes like xapp426/xapp427, UG112, and/or UG575/UG1075. Ultrascale+ Packaging & Pinouts (UG575) tells me that there is in fact a Quad 231 on the right side of the device. D547 . a power pin on one device is a ground pin on another device). 另外， kintex-ultrascale系列器件有官方的开发板吗？. Adding the CLOCK_DEDICATED_ROUTE constrain set to false, eliminate the BUFG auto-adding but the placement fails again with the error: Place 30-99 Placer failed with error: 'IO clock placer failed' Please revise all ERROR, CRITICAL WARNING. comnis2 ,. UltraScale Architecture Configuration 3 UG570 (v1. Selected as Best Selected as Best Like Liked Unlike. 5Gb/s. Up to 674 free user I/O for daughter board connection. PS: IOSTANDARD property is not needed for such port. This helps to achieve timing closure of the design. Zynq™ 7000 SoC Package Files. 6) August 26, 2019 11/24/2015 1. DMA 使用之 ADC 示波器(AN706) 26. . This Bank Diagram in UG575 shows the PCIe4 block and the 4 GTY Quads. Loading Application. // Documentation Portal . Scope. 3 IP name: IBERT Ultrascale GTH version: 1. Article Details. DragonBoard USA Announces Update to UL Floor and Ceiling Assembly G575. Hi @andremsrem2,. However, here are just a few of the “migration considerations” found in ug583. 5. Selected as Best Selected as Best Like Liked Unlike. UltraScale Architecture Configuration User Guide UG570 (v1. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information. 0) and UG575 (v1. 焊接温度如下：100 120 140 160 180 200 235 260，对应的持续时间为：40 40 40 50 50 50 50 40。 查看了UG575的 Soldering Guidelines ，是不是200°以上持续时间偏长（140s），要求是60–150s；且不应该是260度（文档上要求为FFVA1156，Mass reflow:245°）焊接引起的。Ultra-Compact Packaging. pdf either. Like Liked Unlike Reply. . More specific in GT Quad and GT Lane selection. For the measurement conditions, refer to the JESD51-2 standard. "Quad X1 Y5" Starting GT Lane e. . 8mm ball pitch. For UltraScale parts you can find the info in UG575 packaging and pinouts. 1) September 14, 2021 11/24/2015 1. XDC file shows that C0_SYS_CLK_clk_p and C0_SYS_CLK_clk_n are connected to FPGA pins H22 and H23. Expand Post Like Liked Unlike Reply 1 likeAs FPGAs can be used in a variety of different application scenarios we provide general guidance in our packaging user guides and application notes. . The Thermal model should be out soon too. There are Four HP Bank. . g. Usually solder-mask is 4mil larger that the solder land. PL 读写 PS 端 DDR 数据 20. I'm using the KU060 in a relatively low power design. Note: The zip file includes ASCII package files in TXT format and in CSV format. Changing it in the Zynq customize IP window, in Interrupts/Fabric Interrupts/PL-PS Interrupt Ports/IRQ_F2P[15:0], only toggles it on and off but the resulting port is always [0:0]. Kintex™ 7 FPGA Package Files. 感谢！. Can you please suggest what is the recommended PCB pad size for them? Also, We are using via-in-pad structure. Deliverables. Loading Application. We need to use OrCAD symbols in (. So if you look at the package overview section in UG575 you see the conceptual diagram of each VUP device. Please double-check the flight number/identifier. Resources Developer Site; Xilinx Wiki; Xilinx GithubUG575 (v1. How DragonBoard is Made. Even an ACSII version would be helpful. Now i imported my. Hi, Does anybody have the schematic symbol for the VU190 FLGB2104 device? I plan to do my schematic with Altium Designer. Bank 47 and 48 are okay if it places the MIG IP. AMD Adaptive Computing Documentation Portal. (XAPP1267) Using Encryption and Authentication to Secure an UltraScale/UltraScale+ FPGA Bitstream. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information. 6. 7. 9/9/2014. 7. The controller will run up to 2400Mbps in UltraScale and 2667Mbps in UltraScale+. PCIE. 0 5. <p></p><p. pdf · adba5616e0bc482c1dc162123773ced75670d679. Like Liked Unlike Reply. Built on the 14 nm process, and based on the Ellesmere graphics processor, in its Ellesmere XLA variant, the chip supports DirectX 12. デバイス資料 (ザイリンクス) 『Zynq-7000 SoC テクニカル リファレンス マニュアル』 (UG585) は、Zynq SoC のアーキテクチャ、機能、および制御およびステータス レジスタの詳細な説明を含む総合的なユーザー ガイド (1700ページ以上) です。. Also, here is an AR for your reference. Best regards, Kshimizu . Virtex UltraScale Programmable Logic, I/O and Packaging Programmable Logic, I/O & Boot/Configuration Knowledge Base. UG575 gives only an very high level map. In your design guide it said that the GTH bank's supply can be left open if the bank is unused. 3 Product Guide, It is mentioned that PCIe Reset (PERSTN0) on Bank 65 should be used for PCIe Reset. Loading Application. All other packages listed 1mm ball pitch. For 7-Series FPGAs, see UG475. Hello I want to used xcvu440-blgb2377-1-c by vivado 2015. . 8. According to the user guide UG575, the SMBALERT pin is an optional PMBus alert signal, when Low, indicates a system fault . right or left . Hi, I found below links from UG575v1. Due to doc references, I found out I need the Quad X0Y2 (Bank 226), but the doc doesn't specify which lane is routed to the GTM SMA connectors. 1) September 15, 2021 Chapter 1 Overview and Quick Start Introduction to the UltraScale Architecture The Xilinx® UltraScale™ architecture is the first ASIC-class architecture to enable multi-hundred gigabit-per-second levels of system performance with smart processing, while efficiently routing. Changing it in the Zynq customize IP window, in Interrupts/Fabric Interrupts/PL-PS Interrupt Ports/IRQ_F2P[15:0], only toggles it on and off but the resulting port is always [0:0]. UltraScale FPGA BPI Configuration and Flash Programming. 2 V VIH High Level Logic Input Voltage 2. You can refer to UG575 to check which ports can be used as GT's reference clock. 4*120 Pin Panasonic Connectors, Reserved expansion IOs (PS PCIe Gen2 x 4; 2 x USB 3. 6) and X0Y0 for VU125 (as per Figure 1-53 in UG575 v1. Are they marked in ug575-ultrascale-pkg-pinout. For UltraScale and UltraScale+, see UG575. 3 (Cont’d)UG575 (v1. Symbol Description 1, UltraScale Architecture Configuration User Guide UG570 (v1. We would like to show you a description here but the site won’t allow us. I see that some of these are in-stock at digikey. **BEST SOLUTION** Hi @dragonl2000lerl3,. 2 I want to use Aurora 64B66B IP Core for one of the QSFP\+ connectors available on the board. // Documentation Portal . Topics. Download the Device Packaging and Pinouts pdf user guide matching your device familiy (UG575 UltraScale Device Packaging and Pinouts for ultrascales. I just realised that the package XCKU060 FFVA1517 also has MGTAVCC_RN,MGTAVTT_RN,MGTVCCAUX_RN pins. For reference, we provide BRD, Gerber, schematic, and layout files for our evaluation kits. UltraScale Device Packaging and Pinouts UG575 (v1. Offering up to 20 M ASIC gates capacity. AMD Virtex UltraScale+ XCVU13P. com 注 : zip ファイルには、txt および csv 形式の ascii パッケージ ファイルが含まれます。このファイル形式は、 ug575 で説明されています。 This web page provides the pinout files for the UltraScale and UltraScale+ packages, which are used in Xilinx FPGA devices. 5mm min and 0. ,Ltd. // Documentation Portal . A Virtex Ultrascale XCVU065, that has no speed grade and temperature range marking, but it does not even bear a marking forUG575. Hello, I was trying to find some thermal specs for the XCKU115-FLVA1517 Ultrascale FPGA module but am not having any luck. // Documentation Portal . Why?Hi @victor_dotouchshe7 ，. 0. The table shows that the KU11P has 4 PCIe4 Integrated Blocks. com. The AMD DDR4 core can generate a full controller or phy only for custom controller needs. built Z ynq ® UltraScale+™ MPSoC that runs optimally (and exclusively) on the K26 SOM with DDR memory, nonv olatile storage devices, a security module, and an aluminum thermal heat spreader. . You can find that GT quad which is placed in the middle of the SLR is not supported with any PCIe blocks in the device. Table 2: Recommended Operating Conditions. You could check with ug575 how the transceiver banks are placed in the device or have a look at the device view in Vivado. GC inputs can connect to the PHY adjacent to the. 7mm max) for UltraScale devices in B2104 package. Clarified sections of the SelectIO Reso. musthafavakeri (Member) 6 years ago **BEST SOLUTION** Hi All,XCKU060-2FFVA1517E soldering. We would like to show you a description here but the site won’t allow us. Lists. SoC and MPSoC/RFSoC Package Files. Can you please suggest the drill dia and pad dia for the via as well? Regards, Raja GTH bank location errors. In the tab for physical connections if you scroll to the right. However, during the Aurora IP customization I can only select: Starting Quad e. Could you please generate two MIG IP in viavdo? If it meets the pin requirement, vivado passes the implementation. A second way to answer the question is to download the package file for your FPGA from <here>. 0 Gbps single ended (standard I/O)/ up to 32. Download. . Hello, I am using the Zynq Ultrascale\+ MPSoC part #XCZU19EG-2FFVE1924I and looking on page 378 of the UltraScale Device Packaging and Pinouts UG575 (v1. // Documentation Portal . A very similar package (FFVA1156) which I found in the document UG575 has three different heights listed for different parts (Figures 4-12, 4-13 and 4-14), so I'm not sure if the listed nominal height (A=3. R e c o m m e n d e d O p e r a t i n g C o n d i t i o n s. FPGA Bank Columns. . 03/20/2019 1. Does Xilinx provide OrCAD symbol files ? If not, how to use the ASCII Pinout Files in ug575 to create OrCAD symbols in (. I use SMBALERT as an indicator signal on my board, and in some cases, I have noticed that during FPGA startup, where the SMBALERT signal is pull. co. (see figure below). We are referring to UG575, in which Bank Diagram does represent the SYSMON, however, the Block numbers (e. DJE666 (Partner) asked a question. 85V, using -2LE and -1LI devices, the speed specification. 6) and X0Y0 for VU125 (as per Figure 1-53 in UG575 v1. G3 F54 1993 The Physical Object Pagination 2 v. 3. 1) September 14, 2021 11/24/2015 1. This Bank Diagram in UG575 shows the PCIe4 block and the 4 GTY Quads. Expand Post. 12. ddn (AMD) Edited by User1632152476299482873 September 25, 2021 at 3:29 PM **BEST SOLUTION**. I have read in ug575 some recommendations about heatsink attachment for lidless package. -----Expand Post. Product Application Engineer Xilinx Technical SupportWe would like to show you a description here but the site won’t allow us. . FCS2_B is a general-purpose IO pin of the FPGA (see Table 1-5 in UG575(v1.